电子制造工艺材料分析|江苏江测检测|规范和进行质量监控

物理性能：外观、密度、粘度、闪点、沸程、外径、固体含量、吸水率等；

化学性能：酸值、pH 值、铜镜腐蚀性、铜板腐蚀性、水解稳定型、耐油性等；

工艺性能：触变性、助焊性、润湿性、锡槽试验、锡珠试验、喷溅试验等； 电学性能：表面绝缘电阻、电化学迁移、交叉兼容性、体积 / 表面电阻率等； 化学成分：金属及非金属元素成分、有机化合物成分、离子成分等；

力学性能：抗拉强度及延伸率、弯曲强度、剪切强度、180°剥离强度等。

Physical property:appearance, density, viscosity, flash point, boiling distance, external diameter, solid content, water absorption, etc.

Chemical properties:acid value, PH, corrosion of copper mirror, corrosion of copper plate, stability of hydrolysis and oil resistance.

Process performance:thixotropy, solderability, wettability, tin bath test, tin bead test, splash test, etc. Electrical properties:surface insulation resistance, electrochemical migration, cross compatibility, volume / surface resistivity, etc.

Chemical composition:metallic and non-metallic elements, organic compounds, ions, etc.

Mechanical property:tensile strength and elongation, bending strength, shear strength, peel strength of 180 degree, etc.

联系人：焦红娟

电话：0510-81156590

手机：18168893997